Reactions and Mechanisms in Thermal Analysis of Advanced Materials

Tiwari, Atul and Raj, Baldev, eds. (2015) Reactions and Mechanisms in Thermal Analysis of Advanced Materials. Wiley Publishers. ISBN 9781119117575

Full text not available from this repository.
ContributionNameEmail
Abstract: Strong bonds form stronger materials. For this reason, the investigation on thermal degradation of materials is a significantly important area in research and development activities. The analysis of thermal stability can be used to assess the behavior of materials in the aggressive environmental conditions, which in turn provides valuable information about the service life span of the materiel. Unlike other books published so far that have focused on either the fundamentals of thermal analysis or the degradation pattern of the materials, this book is specifically on the mechanism of degradation of materials. The mechanism of rapturing of chemical bonds as a result of exposure to high-temperature environment is difficult to study and resulting mechanistic pathway hard to establish. Limited information is available on this subject in the published literatures and difficult to excavate. Chapters in this book are contributed by the experts working on thermal degradation and analysis of the wide variety of advanced and traditional materials. Each chapter discusses the material, its possible application, behavior of chemical entities when exposed to high-temperature environment and mode and the mechanistic route of its decomposition. Such information is crucial while selecting the chemical ingredients during the synthesis or development of new materials technology.
Item Type: Book
Additional Information: Copyright belongs to Author
Subjects: General > Directors > Baldev Raj > Publications
Date Deposited: 02 Dec 2015 08:15
Last Modified: 02 Dec 2015 11:14
Official URL: http://as.wiley.com/WileyCDA/WileyTitle/productCd-...
Related URLs:
    Funders: UNSPECIFIED
    Projects: UNSPECIFIED
    DOI:
    URI: http://eprints.nias.res.in/id/eprint/906

    Actions (login required)

    View Item View Item